Internal Bond Structural Strength Tester
For determining the internal adhesive force of paper.
Full Description
CODE: E.201.X
Device description
The internal bond tester has a built-in digital display and is microprocessor-controlled. All components are built into a sturdy steel frame. A pendulum mechanism pulls the pendulum back to the starting position after the test and a special specimen holder allows the base plate with the specimen and the aluminum angle to be changed quickly and easily.
Features
- Digital display, integrated microprocessor
- Automatic pendulum return
- Easy insertion of the sample plate thanks to a quick-change system
Connections
| Voltage | 110 – 230 V, 50/60 Hz AC |
|---|---|
| Compressed air | 600 kPa |
Specifications
| Delamination angle of the pendulum to the sample surface | 90° |
|---|---|
| Sample area | 25.6 x 25.6 mm |
| Selectable display of measured values | J/m², kg/cm, ft. Ib/in² |
Models
| code | Article |
|---|---|
| E.201.L.MAN | Internal Bond Tester incl. pendulum with low weight (525 J/m²) and manual sample station |
| E.201.M.MAN | Internal Bond Tester incl. pendulum with medium weight (1 050 J/m²) and manual sample station |
| E.201.H.MAN | Internal Bond Tester incl. pendulum with high weight (2 100 J/m²) and manual sample station |
| E.201.L.AUT | Internal bond tester incl. pendulum with low weight (525 J/m²) and automatic sample station |
| E.201.M.AUT | Internal Bond Tester incl. pendulum with medium weight (1 050 J/m²) and automatic sample station |
| E.201.H.AUT | Internal Bond Tester incl. pendulum with high weight (2 100 J/m²) and automatic sample station |
Applicable standards
TAPPI T569 om-09; TAPPI T833
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